| 圖片 | 型號(hào) | 制造商 | 封裝 | 批號(hào) | |
|---|---|---|---|---|---|
|
EFC2J013NUZTDG | ON/安森美 | QFN |
21+ |
 |
|
|
OPA561PWP | TI/德州儀器 | HTSSOP-20 |
21+ |
|
|
|
SIM900A | SIMCOM | MODULE |
21+ |
|
|
|
HD64F7144F50V | RENESAS/瑞薩 | QFP122 |
21+ |
|
|
|
W27C512-45 | WINBOND/華邦 | DIP-28 |
21+ |
|
|
|
S25FL127SABMFI103 | SPANSION | SOP8 |
21+ |
|
|
|
MCP1826S-1202E/DB | MICROCHIP/微芯 | SOT223 |
21+ |
|
|
|
MCP1826S-3302E/DB | MICROCHIP/微芯 | SOT223 |
21+ |
|
